MediaTek has just announced three new power-efficient chipsets in their Dimensity family: the Dimensity 7400, 7400X, and 6400. These processors are designed to complement their flagship offerings while making advanced features more accessible at lower price points.
Dimensity 7400 and 7400X Highlights
These mid-range chipsets feature:
- Octa-core CPU with 4 Cortex-A78 cores (2.6GHz) and 4 Cortex-A55 cores (2.0GHz)
- Arm Mali-G615 MC2 GPU
- Built on TSMC’s efficient 4nm process
- 14-36% less power consumption while gaming compared to competitors
- MediaTek Advanced Gaming Technology 3.0 support
- NPU 6.0 with 15% better AI performance than previous generation
- Imagiq 950 ISP with advanced AI camera features
- Google Ultra HDR support
- 5G connectivity with 3CC carrier aggregation
- Tri-band Wi-Fi 6E support
The 7400X also adds support for dual-display flip phones, giving manufacturers more design flexibility.
Dimensity 6400 Features
This more affordable chipset includes:
- Octa-core CPU with 2 Cortex-A76 cores (2.5GHz) and 6 Cortex-A55 cores (2.0GHz)
- Arm Mali-G57 MC2 GPU
- Built on TSMC’s 6nm process node
- Up to 19% less power consumption while gaming
- MediaTek Bluetooth Wi-Fi HyperCoex Technology to reduce gaming latency by up to 90%
- Release 16 Sub-6 5G Modem with 2CC-CA
- Up to 33% faster downlink and 18% faster uplink speeds
- 10-bit display support with True Color Accuracy
- Support for 108MP camera sensors with advanced noise reduction
According to Dr. Yenchi Lee, General Manager of MediaTek’s Wireless Communications Business, these chipsets demonstrate MediaTek’s commitment to bringing premium smartphone experiences to more affordable price ranges.
The first smartphones with the Dimensity 7400 and 7400X will be available in Q1 2025, while the Dimensity 6400 is already available.
